Socionext Expands 3DIC Support with Advanced 3D Die Stacking and 5.5D in Packaging Portfolio
Production-Ready 3DIC Technology for Compact, Power-efficient Consumer Applicationsand High-performance AI and HPC Devices YOKOHAMA, Japan, Aug. 27, 2025 /PRNewswire/ — Socionext, the Solution SoC company, today announced the availability of 3DIC… Read More »Socionext Expands 3DIC Support with Advanced 3D Die Stacking and 5.5D in Packaging Portfolio